SanDisk Announces World’s First 256GB 3D NAND Chip

SanDisk, in collaboration with Toshiba, has announced the world’s first 256GB 3-bit-per-cell (X3) 48-layer 3D NAND chip. The new 256GB chip targets diverse applications, including consumer SSD, smartphones, tablets and memory cards, and enterprise SSD for data centres.

Based on a 48-layer stacking process, the BiCS Flash offers enhanced write/erase reliability endurance and boosts write speeds in comparison with the mainstream 2D NAND Flash memory.

SanDisk announces world’s first 3-bit-per-cell 48-layer 3D NAND chip

“We are pleased to announce our first 3D NAND chip targeted for production,” said Dr. Siva Sivaram, Executive Vice President, Memory Technology, SanDisk. “This is the world’s first 256GB X3 chip, developed using our industry-leading 48-layer BiCS technology and demonstrating SanDisk’s continued leadership in X3 technology. We will use this chip to deliver compelling storage solutions for our customers.”

Sample shipments are expected to start in September 2015. The company is yet to announce the pricing and global availability.